ProblemsaboutsurfacemountingprocessforfinepitchdevicesandreasonsonsolderbridgingofLtypeleaddevicesweldedaredepicted.Bridgingmechanismandinfluencefactorsareanalyzedwithtwo-dimensionalgeometricmodel.Basedonthis,high-densitysurfacemounttechnology(SMT)forfinepitchLtypeleaddevicesheatedbyscan-ninglaserisraised.SurfacemountprocessforQFP208onprintedcircuitboard(PCB)isstudied.Theresultsoftestsarethatitisquitepossibletosolvethesolderbridgingofsurfacemountingforpitchdeviceswithscanninglaser-heat-ingmethod.
