简介:第十节粘结片的储存与叠书2.回流线(接2014年第2期)2.2半自动回流线与手动生产线半自动回流线叠书(叠BOOK)时,粘结片料叠及铜箔是由人工操作送入叠BOOK台。不锈钢板、托板、盖板的移送仍然由移板机操作。采用半自动回流线虽然可以降低投资强度,但劳动强度比全自动回流线要大许多,产品外观质量的保证也比自动线差了好多。半自动回流线生产中必须把好下面几个工艺关口。2.2.1铜箔的裁切半自动回流线的铜箔裁切在另一个地方单独进行,环境净化度通常在10000级。铜箔裁切机可以切单卷,也可以同时切两卷。切两卷是通常让两张铜箔背背相对(即铜箔光面相对),这样可以防止在叠BOOK过程胶粉污染到铜箔的光面,这种铜箔切机最薄只能切到18μm铜箔。
简介:Fe2O3和ZnO的粉末混合物是在一家高精力的行星的球工厂的milled综合ZnFe2O4和X光检查粉末diffractometry被用来获得阶段,雏晶尺寸和Fe2O3和ZnFe2O4的microstrain的相对内容。Fe2O3的格子常数被房间精炼方法获得。macrokinetics和事的结构进化被学习,结果证明ZnFe2O4的mechanochemical合成的动力学过程适合Avrami-Erofe'ev模型并且被成核生长机制,和结构的macrokinetics理论在燃烧合成研究控制区域能被用来也描述运动过程。
简介:Thenormallycenteredelectronbeamandnon-centeredelectronbeamweldingofTiAltoTC4wasinvestigatedinordertoanalyzetheelectronbeamweldabilitybetweenTiAl/TC4dissimilarmaterials.MacroscopiccoldcrackeasilyoccurrednearTiAlsubstrateinthejoints.Theoptimaltensilestrengthwasrelatedtotheweldingheatinput.Theweldstructureswerecomposedofbulkycolumnargrainsandequiaxedgrains.Theisolatedphasesconsistedoflargequantitiesofα2-Ti3Alphase,smallquantityofB2phase,γ-TiAlphaseandYAl2phase.InsufficientmeltingofthebasemetaloccurredintheweldwhenthebeampositionleanedtotheTC4side.Thetensilestrengthcouldbeimprovedwhenthedeflectionwaslimitedintheoptimumrange.Otherwise,non-fusionzonewaseasilygeneratedintheweld,whichledtothelowtensilestrength.
简介:本文针对N4/1Cr18Ni9Ti与N4/0Cr25Ni20复合板的特殊焊接要求,根据NB/T47014—2011《承压设备焊接工艺评定》的要求,制备2块N4/1Cr18Ni9Ti试板,2块N4I/0Cr25Ni20试板,尺寸均为500mmX150mmX(4+14)mm。不锈钢基层采用GTAW打底,焊丝选用HOCr21Ni10,SMAW填充与盖面,焊条选用A302与A402。镍复层的焊接采用手工钨极氩弧焊,焊丝选用含Ti、AI等脱氧元素的ERNi-1焊丝,保护气体选择98%Ar+2%H2。试板焊接完成,外观检验合格后进行100%RT,检测结果符合JB厂r4730,2—2005I级合格,镍复层进行100%PT,检测结果符合JB/T4730.5—2005I级。两种焊接试板分别取样并做拉伸、弯曲力学性能分析,镍复层焊缝做化学成分分析。通过两块焊接试板试验对比,不锈钢基层焊接材料选择HOCr21Ni10焊丝与A302焊条。镍复层焊接采用ERNi-1焊丝,焊接保护气体为98%Ar+2%H2。通过焊接工艺评定试验研究,解决了N4/1Cr18Ni9Ti与N4I/0Cr25Ni20复合板焊接问题,提高了用户坩埚的返修质量与再次使用寿命,为使用单位节约了成本。
简介:ThedosimetricphosphorsLi_3PO_4:M(M=Tb,Cu)wereproducedbymodifiedsolid-statemethod.ThestructuralandmorphologicalcharacterizationwascarriedoutthroughX-raydiffraction(XRD)andscanningelectronmicroscope(SEM).Additionally,thephotoluminescence(PL),thermoluminescence(TL)andopticallystimulatedluminescence(OSL)propertiesofpowderLi_3PO_4dopedwithTbandCuwerestudied.ItisadvocatedthatLi_3PO_4:CuphosphornotonlyshowshigherOSLsensitivity(25timesormore)butalsogivesfasterdecayinOSLsignalsthanthatofLi_3PO_4:Tb~(3+)phosphor.Theminimumdetectabledose(MDD)ofLi_3PO_4:M(M=Tb,Cu)phosphorsisfoundtobe21.69×10~(-3)and3.33×10~(-6)J·kg~(-1),respectively.InOSLmode,phosphorshowslineardoseresponseintherangeof0.02-20.00J·kg~(-1).InTLmode,sensitivityofLi_3PO_4:CuphosphorismorethanthatofLi_3PO_4:Tbphosphor.Thekineticsparameterssuchasactivationenergyandfrequencyfactorsweredeterminedbypeakshapemethod,andphotoionizationcrosssectionsofpreparedphosphorwerecalculated.