简介:文章针对集成电路产品的封装长期可靠性,期可靠性的考评,按照国际标准的要求进行了分析。了研究和总结,并且针对实际产品进行了案例分析。用条件下长期使用的稳定性,有一定的应用价值。
简介:Theobjectiveofthisworkistoanalysefatiguereliabilityofdeckstructuressubjectedtocorrelatedcrackgrowth.Thestressintensityfactorsofthecorrelatedcracksareobtainedbyfiniteelementanalysisandbasedonwhichthegeometrycorrectionfunctionsarederived.TheMonteCarlosimulationsareappliedtopredictthestatisticaldescriptorsofcorrelatedcracksbasedontheParis-Erdoganequation.Aprobabilisticmodelofcrackgrowthasafunctionoftimeisusedtoanalysethefatiguereliabilityofdeckstructuresaccountingforthecrackpropagationcorrelation.Adeckstructureismodelledasaseriessystemofstiffenedpanels,whereastiffenedpanelisregardedasaparallelsystemcomposedofplatesandarelongitudinal.Ithasbeenproventhatthemethoddevelopedherecanbeconvenientlyappliedtoperformthefatiguereliabilityassessmentofstructuressubjectedtocorrelatedcrackgrowth.