简介：ProblemsaboutsurfacemountingprocessforfinepitchdevicesandreasonsonsolderbridgingofLtypeleaddevicesweldedaredepicted.Bridgingmechanismandinfluencefactorsareanalyzedwithtwo-dimensionalgeometricmodel.Basedonthis,high-densitysurfacemounttechnology(SMT)forfinepitchLtypeleaddevicesheatedbyscan-ninglaserisraised.SurfacemountprocessforQFP208onprintedcircuitboard(PCB)isstudied.Theresultsoftestsarethatitisquitepossibletosolvethesolderbridgingofsurfacemountingforpitchdeviceswithscanninglaser-heat-ingmethod.
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