简介:ReactiveionetchingcharacteristicsofGaAs,GaSb,InPandInAsusingCl2/Arplasmahavebeeninvestigated,itisthat,etchingratesandetchingprofilesasfunctionsofetchingtime,gasflowratioandRFpower.Etchratesofabove0.45μm/rinand1.2μm/rinhavebeenobtainedinetchingofGaAsandGaSbrespectively,whileveryslowetchrates(<40nm/rin)wereobservedinetchingofIn-containingmaterials,whichwerelinearlyincreasedwiththeappliedRFpower.EtchedsurfaceshaveremainedsmoothoverawiderangeofplasmaconditionsintheetchingofGaAs,InPandInAs,however,werepartlyblackenedinetchingofGaSbduetoaroughappearance.