简介：Inthisstudy,atwo-stepheatingprocessisintroducedfortransientliquidphase(TLP)diffusionbondingforsoundjointswithT91heatresistantsteels.Atfirst,ashort-timehighertemperatureheatingstepisaddressedtomelttheinterlayer,followedbythesecondsteptocompleteisothermalsolidificationatalowtemperature.Themostcriticalfeatureofournewmethodisproducinganon-planarinterfaceattheT91heatresistantsteelsjoint.WeproposeatransitionalliquidphasebondingofT91heatresistantsteelsbythisapproach.Sincejointmicrostructureshavebeenstudied,wetestedthetensilestrengthtoassessjointmechanicalproperty.Theresultindicatesthatthesolidifiedbondmaycontainaprimarysolid-solution,similarcompositiontotheparentmetalandfreefromprecipitates.Jointtensilestrengthofthejointisnotlowerthanparentmaterials.Jointbend'sstrengthsareenhancedduetothehighermetal-to-metaljunctionproducinganon-planarbondlines.Nevertheless,thetraditionaltransientliquidphasediffusionbondingproducesplanarones.Bondingparametersofnewprocessare1260℃for0.5minand1230℃for4min.
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