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Effects of Al, Ga, and Ag on the anti-oxidation and wetting reactions of Sn-gZn-X solders

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DOI rdxgoqv54l/767573

作者王慧;薛松柏;陈文学

机构地区不详

出处《中国焊接：英文版》 2009年2期

关键词界面反应无铅焊料抗氧化润湿性 Sn 俄歇电子能谱

分类 [金属学及工艺][焊接]

出版日期 2009年02月12日（中国期刊网平台首次上网日期，不代表论文的发表时间）

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来源期刊

中国焊接：英文版

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相关关键词

界面反应无铅焊料抗氧化润湿性 Sn 俄歇电子能谱

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