Residual stress evolution regularity in thermal barrier coatings under thermal shock loading-中国期刊网

摘要 Residualstressevolutionregularityinthermalbarrierceramiccoatings(TBCs)underdifferentcyclesofthermalshockloadingof1100℃wasinvestigatedbythemicroscopicdigitalimagecorrelation(DIC)andmicro-Ramanspectroscopy,respectively.Theobtainedresultsshowedthat,asthecyclenumberofthethermalshockloadingincreases,theevolutionoftheresidualstressundergoesthreedistinctstages:asharpincrease,agradualchange,andareduction.TheextensionstressneartheTBCsurfaceisfasttransformedtocompressiveonethroughjustonethermalcycle.Afterdifferentthermalshockcycleswithpeaktemperatureof1100℃,phasetransformationinTBCdoesnothappen,whereasthegeneration,development,evolutionofthethermallygrownoxide(TGO)layerandmicro-cracksarethemainreasonscausingtheevolutionregularityoftheresidualstress.

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Residual stress evolution regularity in thermal barrier coatings under thermal shock loading

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Residual stress evolution regularity in thermal barrier coatings under thermal shock loading

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